Tantalum Targets
Tantalum Targets
Tantalum target materials are high-purity tantalum products, primarily used in physical vapor deposition (PVD) processes such as magnetron sputtering and electron beam evaporation. These materials serve as the source for depositing thin films of tantalum or tantalum-based compounds onto various substrates.
Key Features
High Purity
Typically 99.95% (3N5) to 99.999% (5N5) to ensure film quality and performance.
Excellent Density
Near-theoretical density minimizes porosity and enhances structural integrity during sputtering.
Superior Metallurgical Properties
High melting point (~3017°C), good corrosion resistance, and reliable mechanical strength.
Customizable Forms
Available in various shapes (rectangular, circular, tubular) and sizes, with options for bonding to different backing plates.
Core Material & Technical Specifications
Purity Grades
Ultra-high purity: 99.99% (4N), 99.995% (4N5), 99.999% (5N)
Industrial high purity: 99.95% (3N5)
Custom purity grades available per customer requirements
Physical & Mechanical Properties
| Property | Typical Value (4N Ta) | Test Standard |
|---|---|---|
| Density | ≥16.6 g/cm³ | ASTM B311 |
| Hardness (HV) | 120-180 | ASTM E384 |
| Ultimate Tensile Strength | ≥200 MPa | ASTM E8 |
| Elongation | ≥15% | ASTM E8 |
| Grain Size | ≤50 μm (homogeneous equiaxed grain) | ASTM E112 |
Dimensional & Machining Tolerances
Target Thickness: 3mm - 100mm, tolerance ±0.02mm
Target Diameter/Length: 20mm - 1500mm (circular/rectangular/oval), tolerance ±0.05mm
Flatness: ≤0.01mm/m
Surface Roughness: Ra ≤0.2 μm (as-machined), Ra ≤0.05 μm (polished)
Bonding: Vacuum diffusion bonding / indium bonding available (target + backing plate: Cu, Mo, Ta, Ti alloy)
Custom dimensions, shapes and bonding solutions for special sputtering systems
Applications
Semiconductor Industry
Sputtering of tantalum barrier layers for silicon wafer interconnects, CMOS chip manufacturing, and semiconductor device electrodes.
Flat Panel Display (FPD)
Thin-film coating for LCD/OLED display electrodes, touch screen conductive layers, and optical film deposition.
Optical Industry
Anti-reflective coating, high-reflectivity mirror coating for optical lenses, optical fibers, and laser components.
Electronic Components
Tantalum thin-film for capacitors, resistors, RF components, and magnetic storage media (hard disk drive coatings).
Aerospace & Automotive
Wear-resistant, corrosion-resistant thin-film coating for aerospace engine parts, automotive precision components, and decorative/functional coating for metal parts.
Solar Energy
Thin-film solar cell electrode deposition, photovoltaic panel anti-corrosion coating.
Quality Assurance & Certification
We are committed to delivering the highest quality tantalum targets, adhering to strict international standards and rigorous quality control processes. Our manufacturing system holds valid certifications for ISO 9001.
Every batch of tantalum target materials undergoes comprehensive testing by third-party laboratories, including chemical composition analysis, mechanical property testing (tensile strength, yield strength, elongation and hardness), density and purity detection, surface roughness and flatness inspection, as well as grain size analysis. All testing procedures strictly follow standard protocols to ensure the consistent performance, ultra-high purity and exceptional reliability of our tantalum targets in various application scenarios.
ASTM B708
ASTM F1586
DIN 17864
AMS 7725
GB/T 36276